8030-21-579-1101

Sealing Compound

8030215791101 215791101 DEVCON A MIL-C-24176

A chemical composition formulated for coating or for filling voids, cracks, joints or seams of objects and/or materials to exclude foreign matter and/or prevent the transmission of fluids therethrough. It is not designed to act as a primer coating or to be sanded or ground after application. It cannot be wiped off. For items which are specifically compounded to provide electrical insulating characteristics, use INSULATING COMPOUND, ELECTRICAL. Excludes CAULKING COMPOUND; GASKET CEMENT; CORROSION PREVENTIVE COMPOUND; CEMENT, IRON AND STEEL; PLUMBING FIXTURE SETTING COMPOUND; PRESERVATIVE COATING, RUBBER and textile treating compounds. View more Sealing Compound

8030-21-579-1101 SEALING COMPOUND 8030215791101 215791101

Managed by Canada
NSN Created on 6 Jun 1968
Data Last Changed
January 2023
NATO Update Count
1
NATO Data Quality
8030-21-579-1101 SEALING COMPOUND 8030215791101 215791101 1/1
NSN 8030-21-579-1101 (Generic Image) 1/1

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8030-21-579-1101 Related Documents Related Documents 8030-21-579-1101 5+ Documents (More...)

DEVCON A MIL-C-24176 A chemical composition formulated for coating or for filling voids, cracks, joints
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24176 TY2 DOD-PRF-24176 DOD-C-24176 MIL-C-24176 TY2 MIL-C-24176 A chemical composition TY1 PHILLYBOND
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TY2 MIL-C-24176 DEVCON F-2 5130992003864 992003864,24176 MIL-PRF-24176 TY2MIL-C-24176 TY2MIL-C
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Compound 8030215791101 215791101 Interlock Pin 5130992003864 992003864,24176 BLUE 6A MIL-C-24176 TY1
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A chemical composition formulated for coating or for filling voids, cracks, joints or seams DEVCON A
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8030-21-579-1101 Demil Restrictions 8030-21-579-1101

DEMIL: | DEMILI: | CRITICALITY: | HMIC: | PMIC: | EDC: | ADPEC:

8030-21-579-1101 is a Sealing Compound

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