5998-01-512-5930

Backplane Assembly

5998015125930 015125930 105E7901G9

An insulating panel upon which two or more CONNECTOR, RECEPTACLE, ELECTRICAL, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. It provides or completes a circuit between two or more CIRCUIT CARD ASSEMBLY or ELECTRONIC COMPONENTS ASSEMBLY. It may be designed for panel or chassis mounting, or for insertion into a CONNECTOR, RECEPTACLE, ELECTRICAL. Includes motherboards. For items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see PRINTED WIRING BOARD. See also PRINTED CIRCUIT BOARD; CIRCUIT CARD ASSEMBLY and CABLE ASSEMBLY, PRINTED, FLEXIBLE. View more Backplane Assembly

5998-01-512-5930 BACKPLANE ASSEMBLY 5998015125930 015125930

Managed by United States
NSN Created on 4 Sep 2003
Data Last Changed
November 2023
NATO Update Count
2
NATO Data Quality
5998-01-512-5930 BACKPLANE ASSEMBLY 5998015125930 015125930 1/1
NSN 5998-01-512-5930 (Generic Image) 1/1

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5998-01-512-5930 Related Documents Related Documents 5998-01-512-5930 1+ Documents (More...)

6 14 Jan 2004 5998-01-516-1879 Backplane Assembly P560RNCC: 3 | RNVC: 2 | DAC: 4 22 Dec 2003 5998-01-512-5930

5998-01-512-5930 Demil Restrictions 5998-01-512-5930

DEMIL: A | DEMILI: 1 | CRITICALITY: Y | HMIC: N | PMIC: A | EDC: B | ADPEC: 0

5998-01-512-5930 is a Backplane Assembly that does not have a nuclear hardened feature, but does have another critical feature or features such as tolerance, fit restriction or application. Demilitarization of this item has been confirmed and is not currently subject to changes. This item is considered a low risk when released from the control of the Department of Defense. The item may still be subject to the requirements of the Export Administration Regulations (EAR) and the Code of Federal Regulations (CFR). This item is not suspected to be hazardous. This item does not contain a precious metal. This item is sensitive to Electrostatic Discharge.

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