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5980-12-333-6019

Semiconductor Device Assembly

5980123336019 123336019 802124

A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE. View more Semiconductor Device Assembly

5980-12-333-6019 SEMICONDUCTOR DEVICE ASSEMBLY 5980123336019 123336019

Managed by Germany
NSN Created on 12 Jan 1994
Data Last Changed
January 2023
NATO Update Count
1
NATO Data Quality
5980-12-333-6019 SEMICONDUCTOR DEVICE ASSEMBLY 5980123336019 123336019 1/1
NSN 5980-12-333-6019 (Generic Image) 1/1

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5980-12-333-6019 Related Documents Related Documents 5980-12-333-6019 5+ Documents (More...)

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5980-12-333-6019 Demil Restrictions 5980-12-333-6019

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5980-12-333-6019 is a Semiconductor Device Assembly

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5980-12-333-6019 Contracting Technical Data File (CTDF) Contracting Technical Data File (CTDF) 5980-12-333-6019 October 2021

Criticality and Quality

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Life Support:
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Qualified Products List (QPL):

Commercial Properties

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Restrictions

Boeing Rights Guard:
Export Controlled:
Controlled Technical Data Package (TDP):
Restricted Technical Data Package (TDP):
Contains Classified Material
Weapons System Indicator Code (WSIC):
N

Packaging Requirements

Packaging Determination Table:
Packaging Review Code:
Y
Special Packaging Instruction Number (SPIN):
Special Packaging Instruction Number Revision:
Special Packaging Instruction Number Date:
Pallet Reference Number Required: