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5961-00-444-2509

Semiconductor Device Assembly

5961004442509 004442509 2575239

A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE. View more Semiconductor Device Assembly

5961-00-444-2509 SEMICONDUCTOR DEVICE ASSEMBLY 5961004442509 004442509

Managed by United States
NSN Created on 18 Dec 1970
Data Last Changed
November 2023
NATO Update Count
10
NATO Data Quality
5961-00-444-2509 SEMICONDUCTOR DEVICE ASSEMBLY 5961004442509 004442509 1/1
NSN 5961-00-444-2509 (Generic Image) 1/1

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5961-00-444-2509 Related Documents Related Documents 5961-00-444-2509 5+ Documents (More...)

Documents 8310-00-257-5239 1+ Documents ( More... ) https//www.nsnlookup.com /fsg-59/fsc-5961/us 5961-00-444-2509
Semiconductor Device Assembly 5961004442509 142575239 2540-14-257-5239 2540142575239 142575239
00-445-6534 Diode Semiconductor Device Assembly 1641907RNCC: 3 | RNVC: 2 | DAC: 1 1 Jan 1963 5961-00-444-2509
5315-01-257-5239 5315012575239 012575239 is a cylindrically-shaped headless item, having a shank at one or both ends. it is used for aligning, fastening, or transfer of torque and/or thrust by fitting into corresponding holes of another item. it may be threaded on one end.
4330-22-257-5239 4330222575239 222575239 is a machine designed to remove foreign particles and/or impurities from a fluid which is passed through an element of porous material or thin closely spaced disks. it includes a source of power and a circulating pump for forcing the fluid through the system under pressure.

5961-00-444-2509 Demil Restrictions 5961-00-444-2509

DEMIL: B | DEMILI: 3 | CRITICALITY: X | HMIC: N | PMIC: A | EDC: | ADPEC: 0

5961-00-444-2509 is a Semiconductor Device Assembly that does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. This item has been confirmed as a Critical Munitions List Item or a Sensitive Commerce Control List Item and cannot be in the possession of any party anywhere in the World who is not an authorized NATO Government. Any other possessor of this item should mutilate it now as possession violates international and local laws. This item is a US Munitions List Item and must be mutilated to scrap. This item is not suspected to be hazardous. This item does not contain a precious metal.

5961-00-444-2509 Manufacturers Approved Sources 5961-00-444-2509

5961-00-444-2509 Management Data Management Data 5961-00-444-2509

Effective Date
Organization
Unit of Issue
Unit Price
Qty Unit Pack
Dec 1990
Department of the Navy (DN)
EA
Subscribe
1
MOE
USC
Code
Statement
Order of Use
Jump To Code
Qty Per Assy
UOM
Technical Document
Quantative Expression
Department of the Navy (DN)
L
N
Disposal

Navy Navy

Cognizance:
7E
Special Material ID:
MG
Miscellaneous Air Launched Missiles, Depot and Intermediate Items
Issue, Repair, Requisition Restriction Code:
BL
Submit/refer requisitions to NAVICP MECH. Centralized control for issue of repair parts for specific programs/equipment

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