5961-00-411-3235
Semiconductor Device Assembly
5961004113235 004113235 13036-717-1
A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE. View more Semiconductor Device Assembly
November 2023
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Semiconductor Device Assembly 5961004113235 United States (US) 4. 5961-00-411-3235 Marketplace Restrictions
Restrictions 5961-00-411-3235
5961-00-411-3235 is a Semiconductor Device Assembly that does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. This item is considered a low risk when released from the control of the Department of Defense. The item may still be subject to the requirements of the Export Administration Regulations (EAR) and the Code of Federal Regulations (CFR). This item is not suspected to be hazardous. This item does not contain a precious metal.
Approved Sources 5961-00-411-3235
- Part Number
- Manufacturer
- Status
- 13036-717-1
- Manufacturer
- 94756 - The Boeing Company (Active)
- Primary Buy
- Primary Buy
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