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5350-00-276-5858
Lapping And Grinding Compound
5350002765858 002765858 HYPREZ OS DIAMOND COMPOUND 6-0-375
An abrasive grain in a suitable liquid or semiliquid carrier, sometimes known as vehicle or binder, intended for use in hand or machine removal of small quantities of material to close tolerances. View more Lapping And Grinding Compound
November 2023
6
Marketplace 5350-00-276-5858
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Related Documents 5350-00-276-5858 2+ Documents (More...)
United States (US) 4. 5350-00-276-5858 Marketplace Restrictions Approved Sources Datasheet Management
RQST NE Updated Every Day 5350-00-276-5858 RQST Updated Every Day 5350-00-276-5858 RQST NE Related
Lapping And Grinding Compound 5350002765858 Upgrade your Account Upgrade 5350-00-276-5858Lapping
And Grinding Compound5350002765858 002765858 HYPREZ OS Upgrade your Account Upgrade 5350-00-276-5858Lapping
Restrictions 5350-00-276-5858
5350-00-276-5858 is a Lapping And Grinding Compound that does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. Demilitarization of this item has been confirmed and is not currently subject to changes. This item is considered a low risk when released from the control of the Department of Defense. The item may still be subject to the requirements of the Export Administration Regulations (EAR) and the Code of Federal Regulations (CFR). This item has been determined to be hazardous and information is contained in the Hazardous Materials Information Resource System (HMIRS). This item does not contain a precious metal.
Approved Sources 5350-00-276-5858
- Part Number
- Manufacturer
- Status
- 6-0-375
- Manufacturer
- 20566 - Engis Corporation (Active)
- Primary Buy
- Primary Buy
- HYPREZ OS DIAMOND COMPOUND
- 20566 - Engis Corporation (Active)
- Incomplete Secondary Reference
- Incomplete Secondary Reference
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