TM-9-1290-365-24&P Technical and Parts Manual for Paladin Muzzle Velocity System M93 Upgraded Download
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ARMY TM 9-1290-365-24&P D.6.3 Materials Required. Repair materials and other consumable items required are listed in Table D-11. Table D-11. Materials Required Nomenclature Part/Spec. No. Appendix F Item No. Resistor See table D-13 TBD Adhesive MIL-A-46146, Type III 19 Insulation Compound MIL-I-46058 TYPE 1B31 9 Solder SN63WRMAP3 23 Lacing Tape MIL-T-43435-B3/BLK 11 Sealing Compound 83-31 16 Primer 747-55 17 Silicone Compound MIL-C-47113 32 Epoxy Ink Color Black, MIL-I-43553, Type II 33 Antistatic Bag 3271576 31 D.6.4 General Repair Requirements. Refer to figure D-25. The following general requirements apply to the repair of the power supply module . CAUTION The power supply module contains components subject to damage by electrostatic discharge (ESD). Use approved grounding procedures before touching, removing, or inserting circuit card assembly (CCA). a. Ensure that components are properly oriented before installing. b. Square mounting pad designates: (1) Pin 1 of integrated circuit (2) Emitter of transistor (3) Cathode of diode (4) Positive lead of capacitor c. Do not bend leads of components Q1, Q3, Q4, T3, and T4. d. Tie components C4, C12, C33, C43, C54, C77, C85 using MIL-T- 43435-B3 lacing tape. e. Bond all capacitors, transformers and chokes to printed wiring board (PWB) with MIL-A-46146, Type Ill, adhesive before applying insulation compound. f. Use only SN63WRMAP3 tin/lead solder or approved equivalent. CAUTION Insulation compound must not be applied to any connector pins. Inadvertent application of compound to connector pins may require replacement of connector. g. Apply uniform coating of MIL-I-46058 TYPE 1B31 insulation compound 0.003±0.002 in. thick, where compound has been removed during CCA repairs. D-64